R&D Capabilities

Leanpac has been developing high speed embedded systems (System, Backplane, connector, accessories) for many years. To obtain the newest technical specifications and development trend, Leanpac follows up the international standard association such as PICMG and VITA。
We focus not only on high speed backplane and system design but also on the high frequency simulation and measurement technology, investment of high frequency connectors development, including product design, simulation, characteristic impedance, test board design, to high frequency test and analysis. We have successfully developed 10Gbps, 14Gbps, and 28Gbps connectors on the road to maintain our technology energy and market competitiveness.


Design & Simulation    
Solid Works Design         Auto CAD Design Pro-E Design     
CST Studio Suite         Mold Flow Simulation Metal Stress Simulation
Plastic Stress Simulation         Solidworks Enterprise PDM Joint R&D with NTUST


High Frequency Test    
Digital Serial Analyzer Sampling Oscilloscope         Network Analyzer Network Analyzer
Anechoic Chamber         Anechoic Chamber Anechoic Chamber
Test Fixture         High Frequency Test Data  


Thermal Solution    
Thermal Simulation         Test Equipment Temperature Curve